VLSI CHIP INTERCONNECTION TECHNOLOGY USING STACKED SOLDER BUMPS

被引：11

作者：

MATSUI, N ^{[1
]}

SASAKI, S ^{[1
]}

OHSAKI, T ^{[1
]}

机构：

[1] NIPPON TELEGRAPH & TEL PUBL CORP, MUSASHINO ELECT COMMUN LAB, APPL ELECTR LABS, MUSASHINO, TOKYO 180, JAPAN

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 04期

关键词：

D O I：

10.1109/TCHMT.1987.1134795

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：566 / 570

页数：5

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