ELECTRICAL CHARACTERISTICS OF MOSFET UTILIZING OXYGEN ARGON SPUTTER-DEPOSITED GATE OXIDE-FILMS

被引:26
作者
SUYAMA, S
OKAMOTO, A
SERIKAWA, T
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关键词
D O I
10.1109/T-ED.1987.23206
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:2124 / 2128
页数:5
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共 11 条
[1]  
CHAPMAN B, 1980, GLOW DISCHARGE PROCE, P260
[2]   EXPERIMENTAL RESULTS ON SUBMICRON-SIZE P-CHANNEL MOSFETS [J].
FICHTNER, W ;
LEVIN, RM ;
TAYLOR, GW .
ELECTRON DEVICE LETTERS, 1982, 3 (02) :34-37
[3]   MOS DEVICE FABRICATION USING SPUTTER-DEPOSITED GATE OXIDE AND POLYCRYSTALLINE SILICON LAYERS [J].
HABERLE, K ;
FROSCHLE, E .
SOLID-STATE ELECTRONICS, 1980, 23 (08) :855-+
[4]  
JOHANSEN IT, 1966, J APPL PHYS, V37, P479
[5]   DEVICE-QUALITY SIO2-FILMS ON INP AND SI OBTAINED BY OPERATING THE PYROLYTIC CVD REACTOR IN THE RETARDATION REGIME [J].
LAKHANI, AA .
SOLID-STATE ELECTRONICS, 1984, 27 (10) :921-924
[6]   ELECTRON AND HOLE MOBILITIES IN INVERSION LAYERS ON THERMALLY OXIDIZED SILICON SURFACES [J].
LEISTIKO, O ;
GROVE, AS ;
SAH, CT .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1965, ED12 (05) :248-+
[7]   COMPARISON OF PROPERTIES OF DIELECTRIC FILMS DEPOSITED BY VARIOUS METHODS [J].
PLISKIN, WA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1977, 14 (05) :1064-1081
[8]   CLEANING OF SI AND GAAS CRYSTAL-SURFACES BY ION-BOMBARDMENT IN THE 50-1500 EV RANGE - INFLUENCE OF BOMBARDING ENERGY AND SAMPLE TEMPERATURE ON DAMAGE AND INCORPORATION [J].
RABINZOHN, P ;
GAUTHERIN, G ;
AGIUS, B ;
COHEN, C .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (04) :905-914
[9]  
SUYAMA S, IN PRESS J ELECTROCH
[10]  
SZE SM, 1969, PHYSICS SEMICONDUCTO, pCH9