PACKAGING AND COOLING PROBLEMS ASSOCIATED WITH MICROELECTRONICS EQUIPMENT

被引：10

作者：

HONNOR, F

THOMAS, MA

机构：

[1] Mechanical Engineering Laboratory, English Electric Company Limited, Whetstone

来源：

MICROELECTRONICS RELIABILITY | 1969年 / 8卷 / 04期

关键词：

D O I：

10.1016/0026-2714(69)90394-1

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reviews the development of new packaging techniques for electronic equipment and assesses the need for new thermal analysis techniques. Thermal problems in future equipment are considered and possible future cooling systems are presented. © 1969.

引用

页码：331 / &