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Microstructural stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process
被引：48
作者：
Ig Hong, Sun
[1
]
Hill, Mary Ann
[2
]
机构：
[1] Department of Metallurgical Engineering, Chungnam National University, Taedok Science Town, Taejon 305-764, Korea, Republic of
[2] Materials Science Division, Los Alamos National Laboratory, Los Alamos, NM 87545, United States
关键词：
Number:;
W7405-ENG36;
Acronym:;
-;
Sponsor:;
NSF;
Sponsor: National Science Foundation;
971-0803-034-2;
KOSEF;
Sponsor: Korea Science and Engineering Foundation;
D O I：
10.1016/S0921-5093(99)00728-5
中图分类号：
学科分类号：
摘要：
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页码：189 / 197
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