Process development for PWB compatible embedded capacitors

被引：4

作者：

Bhattacharya, Swapan K. ^{[1
]}

Markondeya Raj, P. ^{[1
]}

Balaraman, Devarajan ^{[1
]}

Windlass, Hitesh ^{[1
]}

Tummala, Rao R. ^{[1
]}

机构：

[1] Sch. of Elec./Computer Engineering, Packaging Research Center, Georgia Institute of Technology, Atlanta, GA

来源：

Circuit World | 2004年 / 30卷 / 1 Embedded Passives Technology期

关键词：

Assembly; Capacitors; Printed circuit boards;

D O I：

10.1108/03056120410496360

中图分类号：

学科分类号：

摘要：

This paper addresses materials and processes for printed wiring board compatible embedded capacitors using polymer/ceramic nanocomposites and hydrothermal barium titanate. Polymers allow low temperature fabrication appropriate to the board (MCM-L) technology. The lower dielectric constants of the commercially available polymers can be greatly compensated by incorporating higher permittivity ceramic fillers. Materials requirements for higher capacitance density (> 30nF/cm2) have been addressed through implementation of a novel low-temperature processable hydrothermal barium titanate film on a patterned titanium foil laminated to the PWB. Application of hydrothermal grown barium titanate is currently being evaluated using a multi-layer system-on-package demonstration.

引用

页码：31 / 35+4+6+8

共 10 条

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