A bulk silicon dissolved wafer process for microelectromechanical devices

被引：70

作者：

Gianchandani, Yogesh B. ^{[1
]}

Najafi, Khalil ^{[1
]}

机构：

[1] Center for Integrated Sensors and Circuits, University of Michigan, Ann Arbor, MI 48109-2122, United States

来源：

关键词：

Bulk silicon dissolved wafer process - Comb structures - Electrostatic bonding - Glass wafer - Reactive ion etching - Silicon wafer;

D O I：

10.1109/84.157361

中图分类号：

学科分类号：

摘要：

引用

页码：77 / 85