Using computer models to identify optimal conditions for flip-chip assembly and reliability

被引：6

作者：

Bailey, Christopher ^{[1
]}

Lu, Hua ^{[1
]}

Glinski, Greg ^{[1
]}

Wheeler, Daniel ^{[1
]}

Hamilton, Phil ^{[2
]}

Hendriksen, Mike ^{[2
]}

Smith, Brian ^{[2
]}

机构：

[1] Centre for Numerical Modelling and Process Analysis, School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom

[2] Celestica Limited, Stoke-on-Trent, United Kingdom

来源：

| 1600年 / Emerald Group Publishing Ltd.卷 / 28期

关键词：

Flip-chip assembly;

D O I：

10.1108/03056120210696658

中图分类号：

学科分类号：

摘要：

引用