Junction temperature evaluation model for IGBT module of wind-power converter considering multi-thermal coupling

被引：5

作者：

Li H. ^{[1
]}

Liu S. ^{[1
]}

Li Y. ^{[1
]}

Yang D. ^{[1
]}

Liang Y. ^{[2
]}

Liu J. ^{[3
]}

机构：

[1] State Key Laboratory of Power Transmission Equipment & System Security and New Technology, Chongqing University, Chongqing

[2] Chongqing KK-QIANWEI Wind Power Equipment Co. Ltd., Chongqing

[3] CSIC (Chongqing) Haizhuang Wind Power Equipment Co. Ltd., Chongqing

来源：

Dianli Zidonghua Shebei/Electric Power Automation Equipment | 2016年 / 36卷 / 02期

基金：

中国国家自然科学基金;

关键词：

Doubly fed induction generator; Electric converters; Evaluation; Insulated Gate Bipolar Transistors (IGBT); Junction temperature calculation; Models; Multi-thermal coupling; Power module; Wind power;

D O I：

10.16081/j.issn.1006-6047.2016.02.009

中图分类号：

学科分类号：

摘要：

In order to more correctly describe the junction temperature of the parallel chips on the converter IGBT module of large wind-power unit, an improved junction temperature evaluation model considering the effect of multi-thermal coupling is proposed. Based on the internal structure and the material parameters of the converter IGBT module of 2 MW DFIG (Doubly Fed Induction Generator), the junction temperature distribution and the steady-state effect of multi-thermal coupling are analyzed with FEM (Finite Element Method). The concept of equivalent thermal coupling impedance is introduced to deduce the thermal impedance relation matrix among chips of power module and establish an improved thermal network model considering the effect of multi-thermal coupling. With H93-2MW DFIG as an example, the calculated chip junction temperatures are compared among the improved thermal network model, the FEM model and the traditional thermal network model for different power losses. Results show the necessity and effectiveness of the internal junction temperature calculation considering the effect of multi-thermal coupling for the power module of wind-power converter. The effect of multi-thermal coupling is closely related to the interval between chips and great attention should be paid to the thermal distribution of chips in the middle of module. © 2016, Electric Power Automation Equipment Press. All right reserved.

引用

页码：51 / 56

页数：5

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