共 10 条
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Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys[J] . Yoshiharu Kariya,Masahisa Otsuka.  Journal of Electronic Materials . 1998 (11)
[3]
Lead-free solders for electronic packaging. Sung K K,Amit K S. Journal of Electronic Materials . 1994
[4]
Tensile deformation behavior of Sn-Zn system lead-free solders. Takemoto Tadashi,Takahashi Matsunawa. Symp Microjoing Assem Technol Electron . 1999
[5]
Microstructure changes in Sn-3.5Ag solder alloy during creep[J] . V. I. Igoshev,J. I. Kleiman,D. Shangguan,C. Lock,S. Wong,M. Wiseman.  Journal of Electronic Materials . 1998 (12)
[8]
Effect of Au coating on the wettability of Cu substrate by Sn-Ag eutectic solder. Hissn Z T. Journal of the Japan Institute of Metals . 1999
[9]
A New Pb-ree solder alloy with superior mechanical properities. McCormack M,Jin S. Applied Physics Letters . 1993
[10]
Metallurgy of low temperature Pb-free solders for electronic assembly. Glazor J. International Materials Reviews . 1995