共 3 条
[2]
Curing conditions effects on the characteristics of thermosetting adhesives-bonded wood joints — Part 1: Substrate influence on TTT and CHT curing diagrams of wood adhesives[J] . X. Lu,A. Pizzi.Holz als Roh- und Werkstoff . 1998 (5)
[3]
Low formaldehyde emission, fast pressing, pine and pecan tannin adhesives for exterior particleboard[J] . A. Pizzi,J. Valenezuela,C. Westermeyer.Holz als Roh- und Werkstoff . 1993 (5)