共 6 条
[5]
Study of thermal deformation of microelectronics packaging product by interferometric technique[J] . Qing Xinlin,Wang Guotao,Dai Fulong.Acta Mechanica Sinica . 1997 (2)
[6]
An experimental observation of dislocation nucleation based on the Peierls concept .2 Xing Y M,Dai F L,Wang W. MET MATER-KOREA . 2001