共 6 条
[1]
Measurement of thermalconductivity of individual multiwalled carbon nanotubes by the 3-ωmethod. Choi T Y,Poulikakos D,Tharian J,et al. Applied Physics Letters . 2005
[2]
Microstructure of thick AlN grown onsapphire by high-temperature MOVPE. Imura M,Nakano K,Kitano T,et al. Physica Status Solidi A Applied Research . 2006
[3]
Heat pipe integrated in directbonded copper(DBC)technology for cooling of power electronicspackaging. Ivanova M,Avenas Y,Schaeffer C,et al. IEEE Transactions on Power Electronics . 2006
[4]
Advantages and new development of DBC(Direct BondCopper)substrates. Jurgen S H. Adv Microelectron . 2005
[5]
New type high power lighting emitting diodes based on MCPCBand its opto-electrical characteristics. Li B Q. Guangzi Xuebao . 2005
[6]
Developments in thermal materials and processes forsemiconductor packaging. Dave S. Adv Microelectron . 2005