电容式微传声器的制备研究新进展

被引:3
作者
宁瑾
刘忠立
赵慧
机构
[1] 中国科学院半导体研究所微电子中心
[2] 中国科学院半导体研究所微电子中心 北京
[3] 北京
关键词
电容式微传声器; MEMS工艺;
D O I
暂无
中图分类号
TN641 [传声器(微音器)];
学科分类号
080903 ;
摘要
本文对近几年来运用单片制备方法 ,采用硅微机械加工技术 (MEMS)工艺研制的电容式微传声器进行了详细描述。通过分析和研究指出 ,将微传声器与其外围电路集成在单片上可降低器件噪声 ,采用纹膜或复合膜结构可增加器件的灵敏度 ,根据具体情况优化电极形状和尺寸 ,可以在很大程度上提高微传声器的性能
引用
收藏
页码:9 / 13
页数:5
相关论文
共 14 条
[1]  
Design and fabrication of silicon condenser microphone using corrugated diaphragm technique. Zou Quanbo et al. Journal of microelectromechanical systems, vol 5, No 3, September . 1996
[2]  
Fabrication of a silicon micromachined capacitive microphone using a dry-etch process. Ning Y B,et al. Sensors and Actuators . 1996
[3]  
A new silicon condenser microphone with a p+ silicon membrane. Bourouina T,et al. Sensors and Actuators . 1992
[4]  
Capacitive microphone with low-stress polysilicon membrane and high-stress polysilicon backplate. Altti Torkkeli,et al. Sensors and Actuators . 2000
[5]  
The slot microphone, a new microphone excitation concept. Stoffel A,et al. Sensors and Actuators . 1999
[6]  
Improvement of the perfomance of microphones with a silicon nitride diaphragm and backplate. Scheeper P R,et al. Sensors and Actuators . 1994
[7]  
Optimization of capacitive microphone and pressure sensor performance by capacitor -electrode shaping. Voorthuyzen J A,et al. Sensors and Actuators . 1991
[8]  
A silicon condenser microphone with polyimide diaphragm and backplate. Michael Pedersen,et al. Sensors and Actuators . 1997
[9]  
Capacitive microphone with a surface micromachined backplate using electroplating technology. Berqvist J,et al. Journal of Microbiology . 1994
[10]  
ZnO on Si integrated acoustic sensor. Royer M,et al. Sensors and Actuators . 1983