共 8 条
[1]
A visco-plastic constitutive model for 60 40 tin-lead solder used in IC package joints. Busso E P,Kitano M A. Journal of Engineering Materials and Technology Transactions of the ASME . 1992
[2]
Constitutive equation for the rate-dependent deformation of metals at elevated temperatures. Anand L. ASME Journal of Engineering Material and Technology . 1982
[3]
An internal variable constitutive model for hot working of metals. Brown S B,Kim K H,Anand L. International Journal of Plasticity . 1989
[4]
On the constitutive response of 63Sn37Pb eutectic solder. Skipor A F,Harren S V,Botsis J. Journal of Engineering Materials and Technology Transactions of the ASME . 1996
[5]
Constitutive relation and creep-fatigue life model fro eutectic tin-lead solder. Knecht S,Fox L R. IEEE Transactions on CHMT . 1990
[6]
Constitutive relations for tin-based solder joints. Darveaux R,Banerji K. IEEE Transactions on CHMT . 1992
[7]
Temperature and strain rate effects on tensile strength and inelastic constitutive relationship of Sn-Pb solders. Nose H,Sakane M,Tsukada Y,Nishimura H. Journal of Electronic Defense . 2003
[8]
Rate dependent constitutive relations based on Anand model for 92. 5Pb5Sn2. 5Ag solder. Wilde J,Becker K,Thoben M,et al. IEEE Transactions on Advanced Packaging . 2000