高效率、高可靠性紫外LED封装技术研究

被引：19

作者：

吴震 ^{[1
]}

钱可元 ^{[1
]}

韩彦军 ^{[2
]}

罗毅 ^{[1
]}

机构：

[1] 清华大学深圳研究生院半导体照明实验室

[2] 清华大学电子工程系,集成光电子国家重点实验室

来源：

光电子激光 | 2007年 / 01期

关键词：

紫外LED; 环氧树脂; 硅树脂; 封装;

D O I：

10.16136/j.joel.2007.01.001

中图分类号：

TN312.8 [];

学科分类号：

0803 ;

摘要：

对硅胶和环氧树脂的紫外光透过率、耐紫外光辐照和耐热特性进行了对比研究,进而提出了一种高效率、高可靠性的波长小于380nm的紫外LED封装方案。实验结果表明,新封装结构的LED,发光功率提高了60%以上,是金属与玻璃透镜封装LED的2.7倍;连续工作800h后,发光功率衰减小于5%。

引用

页码：1 / 4

页数：4

共 12 条

[1]

Deep ultraviolet LEDs fabricated in AlInGaN using MEMOCVD. Khan M A. Proceedings of SPIE the International Society for Optical Engineering . 2004

[2]

Japanese semiconductor lighting project based on ultraviolet LED and phosphor system. Tsunemasa Taguchi. Proceedings of SPIE the International Society for Optical Engineering . 2001

[3]

Synthesis and application of deep ultraviolet op-tical quartz glass. WU Jin-dong. New Materials Industrial . 2003

[4]

Comparison of epoxy resins for applications in light-emitting diodes. HUANG Jan-chan,CHU Ying-po,WEI Ming,et al. Advances in Polyolefins . 2004

[5]

Fluorescence spectra of organic light transformfil ms. YANG Ai-ling,WANGJing,WANGJin,et al. Journal of Optoe-lectronics.Laser(光电子.激光) . 2005

[6]

High power UV LEDarrayfor curing photo adhesives. Manfred Hubert,Chris Di mas,Paul Orava,et al. Proceedings of SPIE the International Society for Optical Engineering . 2003

[7]

Study onlight ex-traction efficiency of GaN-basedlight-emitting diode chips. SHENWEI Tu-jin,HU Fei,HAN Yan-jun,et al. Journal of Optoelectronics.Laser(光电子.激光) . 2005

[8]

Organosilicon Synthesis Techn-olog and Product Application. XING Song-min,WANG Yi-lu. . 2000

[9]

Application of deep UV LEDs to chemical and biological sensing. Dasgupta P K,LI Qing-yang,Temkin H,et al. Proceedings of SPIE the International Society for Optical Engineering . 2004

[10]

Development of a newlow-stress hyper red LED encapsulant. Renso J MZ,Hendrik J L B,Berry O,et al. IEEE Transac-tions on Components,Hybrids and Manufacturing Technology . 1989

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