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Air gap formation during IMD deposition to Lower interconnect capcaitance. B. Shied,K. C. Saraswat,J. P. McVittie,et al. IEEE Electron Device Letters, January . 1998
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In-line cure of SOD low-k films. T. Batchalder,W. Cai,J. Bremmer and D. Gray. Solid State Technology . 1999
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Pursuing the perfect low-k dielectric. L. Peters. Semoconductor International, September . 1998
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A computerized direct liquid injection, rapid isothermal processing assisted chemical vapor deposition system for a Teflon amorphous fluoropolymer. R. Sharang pani,R. Sing. The Review of Scientific Instruments . 1997
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Nanoporous silica as an ultra low-k dielectric. C. Jin,J. K. Luttmer,D. M. Smith and T. A. Romos. MRS Bulletin, October . 1997
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Air gap lower k of interconnect dielectrics. B. Shieh,K. Saraswat,M. Deal and J. McVittie. Solid State Technology . 1999
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Anovel air gap intergration scheme for multi-level interconnects using self aligned via plugs. T. Ueda,et al. Symp. on VLSI Technology,June . 1998
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