IGBT焊料层中的空洞对器件热可靠性的影响

被引:14
作者
张健
张小玲
吕长志
佘烁杰
机构
[1] 北京工业大学电子信息与控制工程学院
关键词
绝缘栅双极晶体管; 热模型; 空洞; 可靠性;
D O I
暂无
中图分类号
TN322.8 [];
学科分类号
0805 ; 080501 ; 080502 ; 080903 ;
摘要
根据IGBT的基本结构和工作原理,建立了一种新的IGBT三维热模型。该模型考虑了Si材料的温度特性,模拟研究了焊料层空洞对器件热稳定性的影响。研究表明焊料层空洞对IGBT器件的热稳定性有很大的影响。实测结果、超声波显微镜以及红外显微镜的扫描图片证实模拟结果。该研究结果对于改进IGBT器件的可靠性有一定意义,值得器件应用工程师、设计及工艺工程师参考。
引用
收藏
页码:517 / 521
页数:5
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