镁合金化学镀镍层的生长过程

被引:6
作者
邵忠财
李建中
康凤娣
田彦文
机构
[1] 沈阳理工大学环境与化学工程学院
[2] 东北大学材料与冶金学院
[3] 东北大学材料与冶金学院 辽宁沈阳
[4] 辽宁沈阳
关键词
镁合金; 化学镀; 生长过程; 腐蚀;
D O I
暂无
中图分类号
TQ153.1 [单一金属的电镀];
学科分类号
0817 ;
摘要
The initial nickel deposition for the direct electro le ss nickel plating on non-catalytically active magnesium alloy is critical.The s urface morphology and composition of the initial nickel plating coating are obta ined by means of the scanning electron microscopy (SEM) and the energy dispersiv e X-ray (EDS).In addition, the mass gain/loss in the initial nickel deposition process was measured by using the electro-balance.The results showed that the M gO coating was gradually corroded by the plating solution, at the same time, MgF 2 produced by F-,H+ and MgO was deposited on the substrate during the init ial electroless plating process.The nickel of the initial electroless plating wa s mostly growing on the boundary between the MgF 2 coating and the MgO coating of the activation substrate, and then came to two sides.After that, the Ni-P co ating growth rate to cover with the MgF 2 coating was prior to the MgO coating. The electroless plating was in company with the substrate corrosion,but the elec troless plating rate catalyzed by the exchanged nickel was more than the substra te corrosion rate.
引用
收藏
页码:301 / 305
页数:5
相关论文
共 7 条
[1]   镁合金化学镀镍溶液的老化 [J].
刘新宽 ;
向阳辉 ;
胡文彬 ;
丁文江 .
中国有色金属学报, 2003, (04) :1046-1050
[2]   用复合化学镀层强化沸腾传热 [J].
宋永吉 ;
熊杰明 ;
梁克民 .
化工学报, 2002, (11) :1202-1205
[3]   Ni-P基纳米抗菌复合镀层 [J].
姚素薇 ;
迟广俊 ;
张卫国 ;
任光勋 ;
范君 .
化工学报, 2002, (09) :904-906
[4]   镁合金化学镀镍层的结合机理 [J].
刘新宽 ;
向阳辉 ;
胡文彬 ;
丁文江 .
中国腐蚀与防护学报, 2002, (04) :42-45
[5]   AZ91D镁合金化学镀镍 [J].
霍宏伟 ;
李瑛 ;
王福会 .
中国腐蚀与防护学报, 2002, (01) :15-18
[6]   镁合金化学镀镍磷研究 [J].
刘新宽 ;
向阳辉 ;
胡文彬 ;
丁文江 .
宇航材料工艺, 2001, (04) :21-25
[7]   Mg合金的最新发展及应用前景 [J].
曾荣昌 ;
柯伟 ;
徐永波 ;
韩恩厚 ;
朱自勇 ;
不详 .
金属学报 , 2001, (07) :673-685