共 7 条
[1]
Void-inducedthermal impedancein power semiconductor modules:some transient temperatureeffects. KATSIS D C,VAN WYKJ D. IEEE Transactions on Industry Applications . 2003
[2]
Developing anequivalent thermal model for discrete semiconductor packages. AMMOUS A,SELLAMI F,AMMOUS K,et al. International Journal of Thermal Science . 2003
[3]
Investigation onthe effectof copper leadfram oxidation on package delamination∥Electronics Components and Technology Conference. CHONGC T,LESLIE A,BENGLT. . 1995
[4]
Adhesive dieattach for power application:performance and reliability inplastic package. TIZIANI R,PASSONI G,SANTOSPIRITO G. Microelectronics Reliability . 2002
[5]
Present problems of power module packagingtechnology. SHAMAS NY A. Microelectronics Reliability . 2003
[6]
The semiconductorroadmap for power management in the new millennium. LIDOWA,KINZER D,SHERIDANG,et al. Proceedings of Tricomm . 2001
[7]
Microelectronics package handbook. Raumtaner. . 1988