低银SnAgCuBiNi无铅钎料润湿及溶解行为分析

被引：6

作者：

万忠华 ^{[1
]}

卫国强 ^{[1
]}

师磊 ^{[1
]}

张宇鹏 ^{[2
]}

机构：

[1] 华南理工大学机械与汽车工程学院

[2] 广州有色金属研究院焊接材料研究所

来源：

焊接学报 | 2011年 / 32卷 / 10期

关键词：

无铅钎料; 润湿性; 溶解速率; 显微组织;

D O I：

暂无

中图分类号：

TG425 [钎焊材料];

学科分类号：

080201 ; 080503 ;

摘要：

对Sn0.8Ag0.5Cu2.0Bi0.05Ni(SACBN)和Sn3.0Ag0.5Cu(SAC305)无铅钎料的显微组织、润湿性能和溶解行为进行了比较研究.结果表明,SACBN钎料显微组织由β-Sn+共晶体组成,共晶组织为在β-Sn基体上均匀分布细针状的Ag3Sn、粒状的(Cu,Ni)6Sn5和细小粒状的铋.在相同温度条件下,SACBN钎料的润湿角大于SAC305钎料,铺展面积小于SAC305钎料,但SACBN钎料的最大润湿力却大于SAC305钎料,润湿时间小于SAC305钎料.随着时间的增加,铜在两种钎料中的溶解量均呈线性增加,在250,275℃时铜在SACBN钎料中的溶解速率低于SAC305钎料;在300℃时,铜在SACBN钎料中的溶解速率高于SAC305钎料.

引用

页码：89 / 92+117 +117

页数：5

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