低银无铅焊料润湿及可靠性能研究

被引：5

作者：

符永高 ^{[1
]}

王宏芹 ^{[1
]}

王玲 ^{[1
]}

杜彬 ^{[1
]}

王鹏程 ^{[1
]}

万超 ^{[1
]}

宋志伟 ^{[2
]}

机构：

[1] 中国电器科学研究院

[2] 深圳华为技术有限公司

来源：

电子工艺技术 | 2010年 / 31卷 / 06期

基金：

广东省科技计划;

关键词：

低银焊料; 润湿; 溶解; 裂纹;

D O I：

10.14176/j.issn.1001-3474.2010.06.001

中图分类号：

TG42 [焊接材料];

学科分类号：

080201 ; 080503 ;

摘要：

利用润湿测量法研究了低银无铅焊料SAC0307、SAC0507和SAC0807的润湿性能,发现上述低银焊料润湿性能几乎相同。通过波峰焊接实验鉴定了其溶解铜焊盘性能,发现所做短时间溶铜实验中上述低银焊料的低银焊料的溶铜速度几乎相同。温度循环实验后检测了金属间化合物生长及裂纹发生情况,确定低银无铅焊料SAC0807裂纹萌生率最低。所作实验研究中皆采用共晶锡银焊料SAC305作为参照焊料。

引用

页码：320 / 323+368+372 +368

页数：6

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