LED感应局部加热封装试验研究

被引：10

作者：

陈明祥

马泽涛

刘胜

机构：

[1] 华中科技大学微系统研究中心

来源：

发光学报 | 2007年 / 02期

关键词：

发光二极管; 封装; 感应加热; 局部加热;

D O I：

暂无

中图分类号：

TN312.8 [];

学科分类号：

0803 ;

摘要：

采用感应局部加热技术,对大功率发光二极管(LED)封装进行了试验研究。结果表明,由于感应加热对材料和结构具有选择性,封装过程中仅Cu-Sn合金焊料层加热,实现了芯片和覆铜陶瓷基板间的热键合。封装后的LED性能测试表明,该封装技术不仅降低了热阻,使LED在高电流下(4倍电流)仍能保持较低的工作温度,而且降低了热应力和整体高温对芯片结构的损坏,提高了器件性能和可靠性。

引用

页码：241 / 245

页数：5

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