共 4 条
[3]
聚合物共混体脆韧转变的损伤竞争理论——Ⅰ.损伤竞争准数与脆韧转变判据[J]. 吕素平,漆宗能.中国科学(B辑 化学 生命科学 地学). 1994(10)
[4]
Thermally conductive EMC (Epoxy Molding Compound) encapsulation. Wonho Kim, Jong-too Bae. Polymer Engineer . 1999