Fermi-level pinning at the polysilicon/metal oxide interface - Part I

被引:201
作者
Hobbs, CC [1 ]
Fonseca, LRC
Knizhnik, A
Dhandapani, V
Samavedam, SB
Taylor, WJ
Grant, JM
Dip, LG
Triyoso, DH
Hegde, RI
Gilmer, DC
Garcia, R
Roan, D
Lovejoy, ML
Rai, RS
Hebert, EA
Tseng, HH
Anderson, SGH
White, BE
Tobin, PJ
机构
[1] Motorola Inc, Adv Prod Res & Dev Lab, Technol Solut Grp, Austin, TX 78721 USA
[2] Motorola Inc, Adv Prod Res & Dev Lab, Technol Solut Grp, Tempe, AZ 85284 USA
[3] Kintech Technol Ltd, Moscow 123182, Russia
[4] NanoCoolers, Austin, TX 78721 USA
关键词
Al2O3; Fermi pinning; gate dielectric; HFO2; polysilicon;
D O I
10.1109/TED.2004.829513
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We report here that Fermi pinning at the polysilicon/metal oxide interface causes high threshold voltages in MOSFET devices. Results indicate that pinning occurs due to the interfacial Si-Hf and Si-O-Al bonds for Hfo(2) and Al2O3, respectively. Oxygen vacancies at polysilicon/HfO2 interfaces also lead to Fermi pinning. We show that this fundamental characteristic affects the observed polysilicon depletion. In Part I, the theoretical background is reviewed and the impact of the different gate stack regions are separated out by investigating the relative threshold voltage shifts of devices with Hf-based dielectrics. The effects of the interfacial bonding are examined in Part II.
引用
收藏
页码:971 / 977
页数:7
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