A study of resist outgassing as a function of differing photoadditives

被引:18
作者
Houlihan, FM [1 ]
Rushkin, IL [1 ]
Hutton, RS [1 ]
Timko, AG [1 ]
Nalamasu, O [1 ]
Reichmanis, E [1 ]
Gabor, AH [1 ]
Medina, AN [1 ]
Malik, S [1 ]
Neiser, M [1 ]
Kunz, RR [1 ]
Downs, DK [1 ]
机构
[1] AT&T Bell Labs, Lucent Technol, Murray Hill, NJ 07974 USA
来源
MICROLITHOGRAPHY 1999: ADVANCES IN RESIST TECHNOLOGY AND PROCESSING XVI, PTS 1 AND 2 | 1999年 / 3678卷
关键词
resist outgassing; photoacid generators; 193; nm; 248; e-beam;
D O I
10.1117/12.350209
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effect of different photoadditives in high and low activation energy resist resins on resist outgassing during lithographic exposure was studied by quartz microbalance and gas chromatography/ mass spectroscopy techniques. The resist outgassing was analyzed both qualitatively and quantitatively and structure-property relashionships were developed between resist outgassing and the molecular structure of photoacid generators and additives. The photoadditives examined include, aryl iodonium perfluoroalkylsulfonates, triarylsulfonium perfluoroakylsulfonates, photogenerators of sulfamic acids (Sweet PAG analogs), 2-nitrobenzyl PAG's and doxyl derivatives.
引用
收藏
页码:264 / 274
页数:11
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