Electrodeposition of Cu from acidic sulfate solutions in the presence of bis-(3-sulfopropyl)-disulfide (SPS) and chloride ions

被引：40

作者：

Bozzini, B ^{[1
]}

D'Urzo, L ^{[1
]}

Romanello, V ^{[1
]}

Mele, C ^{[1
]}

机构：

[1] Univ Lecce, Dipartimento Ingn Innovaz, I-73100 Lecce, Italy

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 2006年 / 153卷 / 04期

关键词：

D O I：

10.1149/1.2172555

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

This paper reports an in situ Raman study of Cu electrodeposition from an acidic sulfate solution in the presence of bis-(3-sulfopropyl)-disulfide Na salt (SPS). In the absence of chloride, in situ surface-enhanced Raman spectra scarcely show few labile features in a narrow range of cathodic potential. When Cl- ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.

引用

页码：C254 / C257

页数：4

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