Study of the resist deformation in nanoimprint lithography

被引：113

作者：

Hirai, Y

Fujiwara, M

Okuno, T

Tanaka, Y

Endo, M

Irie, S

Nakagawa, K

Sasago, M

机构：

[1] Univ Osaka Prefecture, Dept Mech Syst Engn, Grad Sch Engn, Sakai, Osaka 5998531, Japan

[2] Matsushita Elect Corp, ULSI Proc Technol Dev Ctr, Semicond Co, Minami Ku, Kyoto 6018413, Japan

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2001年 / 19卷 / 06期

关键词：

D O I：

10.1116/1.1415510

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Numerical simulations and experimental studies are carried out to understand the deformation process of thin polymer film in nanoimprint lithography. Deformation of a thin polymer above its glass transition temperature is studied for various imprinting conditions such as the aspect ratios of a mold pattern, initial thickness of the polymer, and imprinting pressure. Cross-sectional profiles of the deformed polymers are simulated by the finite element method based on a rubber elastic model. The results are compared with experimental data. The areal penetration ratio of the polymer into the recessed groove of the mold and residual thickness underneath the mold are quantitatively evaluated. The simulations and the experimental results agree well with each other. 9 2001 American Vacuum Society.

引用

页码：2811 / 2815

页数：5

共 10 条

[1] IMPRINT OF SUB-25 NM VIAS AND TRENCHES IN POLYMERS [J].