Efficient transient simulation of lossy packaging interconnects using moment-matching techniques

被引:46
作者
Celik, M
Cangellaris, AC
机构
[1] Department of Electrical and Computer Engineering, Center for Electronic Packaging Research, University of Arizona, Tucson
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1996年 / 19卷 / 01期
关键词
moment matching; time domain; lossy packaging interconnects;
D O I
10.1109/96.486486
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This paper introduces enhancements to moment-matching techniques for rapid time-domain computer simulation of packaging interconnect structures. New moment calculating methods are proposed to handle dispersive, lossy interconnects and related package discontinuities, transitions and junctions that are modeled in terms of either numerically extracted or measured frequency-dependent, equivalent transmission line parameters, or scattering parameters. Computer simulations of pulse propagation in interconnects with frequency-dependent ohmic losses are used to demonstrate the validity and accuracy of the proposed methods.
引用
收藏
页码:64 / 73
页数:10
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