Analytical models for transient diffusion and activation of ion-implanted boron during rapid thermal annealing considering ramp-up period

被引:7
作者
Suzuki, K
Aoki, M
Kataoka, Y
Sasaki, N
Hoefler, A
Feudel, T
Strecker, N
Fichtner, W
机构
来源
IEDM - INTERNATIONAL ELECTRON DEVICES MEETING, TECHNICAL DIGEST 1996 | 1996年
关键词
D O I
10.1109/IEDM.1996.554100
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Analyzing experimental boron transient diffusion profiles over a wide temperature range with the process simulator TESIM [1], we evaluated the related transient diffusion time t(E), enhanced diffusivity D-enh, and maximum transient diffusion concentration C-enh. Our extracted values contradict previously reported values, but it is due to the fact that the former works neglected the ramp-up period. We showed that the considering of the ramp-up period is indispensable for the analysis of transient diffusion. We also developed analytical models for t(E), D-enh, and C-enh, and clarified their dependence on physical parameters implemented in TESIM.
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页码:799 / 802
页数:4
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