The effect of embedded Pb on Cu diffusion on Pb/Cu(111) surface alloys

被引:11
作者
Anderson, M. L.
Bartelt, N. C.
Feibelman, P. J.
Swartzentruber, B. S.
Kellogg, G. L.
机构
[1] Sandia Natl Labs, Albuquerque, NM 87185 USA
[2] Sandia Natl Labs, Livermore, CA 94550 USA
关键词
scanning tunneling microscopy; low-energy electron microscopy; density functional calculations; surface diffusion; copper; lead; self-assembly;
D O I
10.1016/j.susc.2006.02.034
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
We have used scanning tunneling microscopy and low-energy electron microscopy to measure the thermal decay of two-dimensional Cu, Pb-overlayer and Ph Cu alloy islands on Pb-Cu(111) surface alloys. Decay rates covering 6-7 orders of magnitude are accessible by applying the two techniques to the same system. We find that Cu adatom diffusion across the surface alloy is rate-limiting for the decay of both Pb and Pb-Cu islands on the surface alloy and that this rate decreases monotonically with increasing Ph concentration in the alloy. The decrease is attributed to repulsive interactions between Cu adatoms and embedded Pb atoms in the surface alloy. The measured temperature dependences of island decay rates are consistent with first-principles calculations of the Cu binding and diffusion energies related to this "site-blockin" effect. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:1901 / 1908
页数:8
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