Uniform COSi2 nano-nucleus formation by oxide mediated silicidation with a Ti capping layer

被引:4
作者
Chang, JJ
Hsieh, TE
Liu, CP
Wang, YL [1 ]
机构
[1] Taiwan Semicond Mfg Co, Hsinchu, Taiwan
[2] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 70101, Taiwan
[3] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu, Taiwan
关键词
oxide mediated epitaxy; cobalt silicide; nucleus; annealing;
D O I
10.1016/j.tsf.2005.07.073
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
The nucleation stage toward CoSi2 with average island size of about 4 nm and uniform island size distribution is obtained from a TiN/Co/ Ti/Co/SiOx/Si multilayer with the SiOx as a mediated layer by annealing at 460 degrees C for 240 s followed by 600 degrees C 240 s. It is found that Ti capping layer can enhance Co diffusion into the Si substrate at higher temperature (600 degrees C 240 s) annealing, which results in larger nucleus size (average grain size about 12 nm) but nonuniform nucleus size distribution. However, two-step annealing for 460 degrees C 240 s followed by 600 degrees C 240 s results in a smaller average nucleus size with better nucleus size distribution. The mechanism responsible for the discrepancy is discussed in the paper. (c) 2005 Elsevier B.V. All rights reserved.
引用
收藏
页码:85 / 89
页数:5
相关论文
共 17 条
[1]
A STUDY OF CHEMICAL BONDING IN SUBOXIDES OF SILICON USING AUGER-ELECTRON SPECTROSCOPY [J].
CHAO, SS ;
TYLER, JE ;
TAKAGI, Y ;
PAI, PG ;
LUCOVSKY, G ;
LIN, SY ;
WONG, CK ;
MANTINI, MJ .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1986, 4 (03) :1574-1579
[2]
The influence of Ti capping layers on CoSi2 formation [J].
Detavernier, C ;
Van Meirhaeghe, RL ;
Cardon, F ;
Donaton, RA ;
Maex, K .
MICROELECTRONIC ENGINEERING, 2000, 50 (1-4) :125-132
[3]
CoSi2 formation through SiO2 [J].
Detavernier, C ;
Van Meirhaeghe, RL ;
Cardon, F ;
Maex, K .
THIN SOLID FILMS, 2001, 386 (01) :19-26
[4]
EFFECTS OF THERMAL HISTORY ON STRESS-RELATED PROPERTIES OF VERY THIN-FILMS OF THERMALLY GROWN SILICON DIOXIDE [J].
FITCH, JT ;
LUCOVSKY, G ;
KOBEDA, E ;
IRENE, EA .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1989, 7 (02) :153-162
[5]
Suppressing baron penetration and cobalt silicide agglomeration in deep submicron p-channel metal-oxide-semiconductor devices [J].
Kamal, AHM ;
Obeidat, AT ;
Budri, T .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (01) :173-179
[6]
Ex situ formation of oxide-interlayer-mediated-epitaxial CoSi2 film using Ti capping [J].
Kim, GB ;
Kwak, JS ;
Baik, HK ;
Lee, SM .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1999, 17 (01) :162-165
[7]
Effect of Ti-capping thickness on the formation of an oxide-interlayer-mediated-epitaxial CoSi2 film by ex situ annealing [J].
Kim, GB ;
Kwak, JS ;
Baik, HK ;
Lee, SM .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (03) :1503-1507
[8]
Silicide formation by concentration controlled phase selection [J].
Pretorius, R ;
Mayer, JW .
JOURNAL OF APPLIED PHYSICS, 1997, 81 (05) :2448-2450
[9]
Structure, interface roughness, and growth mechanism of reactive deposition epitaxy of CoSi2 on Si(100) substrates [J].
Sarkar, DK ;
Rau, I ;
Falke, M ;
Giesler, H ;
Teichert, S ;
Beddies, G ;
Hinneberg, HJ .
APPLIED PHYSICS LETTERS, 2001, 78 (23) :3604-3606
[10]
Suppression of cobalt silicide agglomeration using nitrogen (N+2) implantation [J].
Sun, WT ;
Liaw, MC ;
Hsu, CCH .
IEEE ELECTRON DEVICE LETTERS, 1998, 19 (05) :163-166