Super-fine ink-jet printing: toward the minimal manufacturing system

被引:105
作者
Murata, K [1 ]
Matsumoto, J
Tezuka, A
Matsuba, Y
Yokoyama, H
机构
[1] Natl Inst Adv Ind Sci & Technol, Nanotechnol Res Inst, Tsukuba, Japan
[2] Natl Inst Adv Ind Sci & Technol, Res Inst Computat Sci, Tsukuba, Japan
[3] Harima Chem Inc, Tsukuba Res Ctr, Tsukuba, Ibaraki, Japan
来源
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS | 2005年 / 12卷 / 1-2期
关键词
Bulge Formation; Direct Printing; Metal Circuit; Free Boundary Flow; Wafer Level Package;
D O I
10.1007/s00542-005-0023-9
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We have developed an ink-jet system which allows arrangements of dots with a submicron minimum size. Using an ultra-fine silver paste, we achieved the direct print of metallic wires of only a few micrometers in width without any pre-patterning treatment of the substrate, hydrophobic/hydrophilic patterning, bank patterning etc. We also propose an application, such as direct printing of ultra-fine redistribution wiring for a build-up board and/or package. Since all of these processes can be carried out at atmospheric pressure on the desktop without special treatment of the substrate. The direct fabrication process using ink-jet printing can be expected to be a powerful tool for both nanotechnology research and applications such as micro electronics, etc.
引用
收藏
页码:2 / 7
页数:6
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