Visco-elastic-plastic properties and constitutive modeling of underfills

被引：22

作者：

Qian, ZF ^{[1
]}

Wang, JJ ^{[1
]}

Yang, J ^{[1
]}

Liu, S ^{[1
]}

机构：

[1] Wayne State Univ, Dept Mech Engn, Detroit, MI 48202 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 1999年 / 22卷 / 02期

基金：

美国国家科学基金会;

关键词：

constitutive model; flip-chip package; nonlinear property; test; underfill;

D O I：

10.1109/6144.774721

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The thermo-mechanical testing of HYSOL FP4526 underfill is reported, including the details of sample preparation and test procedures. It is found that the Young's modulus of the underfill depends on both temperature and applied strain rate. The constitutive framework proposed for solder alloys [1], [2] has been applied successfully to model the thermo-mechanical properties of the underfill in this paper. Excellent agreement between model predictions and experimental data is achieved. The test data and calibrated constitutive model can be used for the analysis and design of advanced electronic packages with underfills such as hip-chip packages.

引用

页码：152 / 157

页数：6

共 19 条

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[7]

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[8]

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[9]

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[10]

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