Enhanced thermal contact conductance using carbon nanotube array interfaces

被引：81

作者：

Xu, Jun ^{[1
]}

Fisher, Timothy S.

机构：

[1] Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA

[2] Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2006年 / 29卷 / 02期

关键词：

carbon nanotubes (CNTs); enhanced thermal contact conductance; microwave plasma enhanced chemical vapor deposition (PECVD);

D O I：

10.1109/TCAPT.2006.875876

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Heat-conduction interfaces that employ carbon nanotube (CNT) arrays have been fabricated and studied experimentally using a reference calorimeter testing rig in a vacuum environment with infrared temperature measurements. Arrays of multiwalled CNTs are grown directly on silicon substrates with microwave plasma-enhanced chemical vapor deposition. Iron and nickel were used as CNT catalysts. CNT arrays grown under different synthesis conditions exhibit different pressure-contact conductance characteristics. The thermal contact resistance of CNTs with a copper interface exhibits promising results with a minimum value of 19.8 mm(2) K/W at a pressure of 0.445 MPa.

引用

页码：261 / 267

页数：7

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[1] Roughness evolution in polyimide films during plasma etching [J].