Thermal modeling of diamond-based power electronics packaging

被引：70

作者：

Fabis, PM ^{[1
]}

Shum, D ^{[1
]}

Windischmann, H ^{[1
]}

机构：

[1] Norton Diamond Film, Northborough, MA 01532 USA

来源：

FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM | 1999年

关键词：

D O I：

10.1109/STHERM.1999.762434

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

Finite element modeling suggested the thermal performance of plastic and ceramic packages could be significantly improved through the insertion of cvd diamond substrates. The model was formulated considering the thermal properties, dimensions, and spatial locations of the materials comprising the dominant, conductive thermal path. Optimized designs were selected targeting the minimization of die junction temperature, package maximum temperature, and package temperature gradients through the reduction of the heat source to heat sink thermal resistance. Selected designs were fabricated and thermally evaluated using infrared thermometry. Diamond-enhanced package designs using leadframe-substrate "overlaps" for plastic SOIC packages and through-flange "inserts" for ceramic power packages realized junction temperature decreases of greater than 50%.

引用

页码：98 / 104

页数：7