Thermal instability of silicon-on-insulator thin films measured by low-energy electron microscopy

被引:15
作者
Bussmann, E. [1 ]
Cheynis, F. [1 ]
Leroy, F. [1 ]
Mueller, P. [1 ]
机构
[1] Aix Marseille Univ, CNRS, UPR 3118, Ctr Interdisciplinaire Nanosc Marseille, F-13288 Marseille 9, France
来源
INNOVATIONS IN THIN FILM PROCESSING AND CHARACTERISATION (ITFPC 2009) | 2010年 / 12卷
关键词
DECOMPOSITION; KINETICS; OXIDE;
D O I
10.1088/1757-899X/12/1/012016
中图分类号
TB3 [工程材料学];
学科分类号
082905 [生物质能源与材料];
摘要
Using low-energy electron microscopy (LEEM), we investigate the ultrahigh vacuum annealing of silicon-on-insulator (SOI) samples capped by a chemically-prepared oxide layer. Consistent with previous reports: (1) for T > 750 degrees C, the capping-oxide decomposes by void nucleation and growth, then (2) for T > 850 degrees C, the Si thin-film dewets from the SiO2 substrate. Here, we show that the morphological evolution of the surface during the dewetting process is dependent on the preparation of the SOI surface. Two dewetting pathways are evident in recent literature, we find that one evolution is characteristic of clean Si(100)-2 x 1 surfaces, while the other is correlated with surface contamination.
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页数:4
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