Evidence of the C60/Cu contact formation after thermal treatment

被引:10
作者
Cho, SW
Seo, JH
Kim, CY
Yoo, KH
Jeong, K
Whang, CN
Yi, Y
Kang, SJ
Noh, M
机构
[1] Yonsei Univ, Inst Phys & Appl Phys, Seoul 120749, South Korea
[2] Univ S Florida, Dept Elect Engn, Tampa, FL 33620 USA
[3] Univ Illinois, Dept Mat Sci & Engn, Urbana, IL USA
[4] LOT Vacuum Co Ltd, Ansong 456370, South Korea
关键词
D O I
10.1063/1.2193038
中图分类号
O59 [应用物理学];
学科分类号
摘要
The origin of the lowered electron injection barrier height of C-60/Cu was investigated by in situ ultraviolet photoelectron spectroscopy and x-ray photoelectron spectroscopy (XPS). The onset of the highest occupied molecular orbital level was shifted by 0.2 eV toward high binding energy upon the heat treatment, resulting in the improved injection characteristics of the device. Moreover, an unexpected gap state has been observed at 1.2 eV below the Fermi level. The XPS core-level spectra revealed that the chemical reaction between C-60 and Cu at the interface induced the gap state after heat treatment. The gap state pinned the Fermi level close to the lowest unoccupied molecular orbital of C-60. We obtained the complete energy level diagram of C-60/Cu before and after the heat treatment.
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页数:3
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