Recent developments in EUV reflectometry at the advanced light source

被引:124
作者
Gullikson, EM [1 ]
Mrowka, S [1 ]
Kaufmann, BB [1 ]
机构
[1] Univ Calif Berkeley, Lawrence Berkeley Natl Lab, Ctr Xray Opt, Berkeley, CA 94720 USA
来源
EMERGING LITHOGRAPHIC TECHNOLOGIES V | 2001年 / 4343卷
关键词
EUV lithography; reflectometry; metrology; multilayer reflectivity;
D O I
10.1117/12.436712
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In order to satisfy the metrology requirements of multilayer coatings for EUVL optics and masks, improvements have been made to the reflectometry beamline at the Advanced Light Source. The precision in determining multilayer peak reflectance and wavelength has been improved by reducing the measurement noise. The peak reflectance of a typical Mo/Si multilayer can now be measured with a precision of 0.08% rms,(relative) and the centroid wavelength with a precision of 0.007% rms. It has now been possible to determine the contribution of scattered light to the spectral purity. Under the typical measurement conditions the scattered light accounts for about 1.3% of the incident beam. With an appropriate slit it is possible to reduce the scattered light to 0.25%. By correcting for the remaining scattered light, it is estimated that a reflectance accuracy of 0.1% (absolute) is obtained for a typical Mo/Si multilayer.
引用
收藏
页码:363 / 373
页数:11
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