Sputter deposition of cathodes in organic light emitting diodes

被引:84
作者
Hung, LS [1 ]
Liao, LS
Lee, CS
Lee, ST
机构
[1] Eastman Kodak Co, Imaging Res & Adv Dev, Rochester, NY 14650 USA
[2] City Univ Hong Kong, Dept Phys & Mat Sci, Hong Kong, Peoples R China
关键词
D O I
10.1063/1.371410
中图分类号
O59 [应用物理学];
学科分类号
摘要
Sputter deposition was employed for cathode preparation in organic light emitting diodes (OLEDs). A thin film of copper phthalocyanine (CuPc) was found to be an effective buffer layer in preventing sputter damage to the OLED layer structure. However, the CuPc layer forms an electron-injection barrier with the underlying Alq layer, resulting in increased electron-hole recombination in the nonemissive CuPc layer, and thus a substantial reduction in electroluminescence efficiency. Incorporation of Li at the CuPc/Alq interface from a sputter-deposited Al (Li) cathode was found to reduce the injection barrier at the interface and make the overall device efficiency comparable to a device having an evaporated MgAg cathode. The devices exhibited good operational stability with a half lifetime greater than 3800 h at 20 mA/cm(2). (C) 1999 American Institute of Physics. [S0021-8979(99)08520-5].
引用
收藏
页码:4607 / 4612
页数:6
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