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SiGe-technology and components for mobile communication systems
被引:36
作者
:
Schuppen, A
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Schuppen, A
[
1
]
Dietrich, H
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Dietrich, H
[
1
]
Gerlach, S
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Gerlach, S
[
1
]
Hohnemann, H
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Hohnemann, H
[
1
]
Arndt, J
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Arndt, J
[
1
]
Seiler, U
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Seiler, U
[
1
]
Gotzfried, R
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Gotzfried, R
[
1
]
Erben, U
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Erben, U
[
1
]
Schumacher, H
论文数:
0
引用数:
0
h-index:
0
机构:
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
Schumacher, H
[
1
]
机构
:
[1]
TEMIC TELEFUNKEN MICROELECT GMBH,D-74025 HEILBRONN,GERMANY
来源
:
PROCEEDINGS OF THE 1996 BIPOLAR/BICMOS CIRCUITS AND TECHNOLOGY MEETING
|
1996年
关键词
:
D O I
:
10.1109/BIPOL.1996.554626
中图分类号
:
TM [电工技术];
TN [电子技术、通信技术];
学科分类号
:
0808 ;
0809 ;
摘要
:
引用
收藏
页码:130 / 133
页数:4
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