Electroless plating of nickel on silicon for fabrication of high-aspect-ratio microstructures

被引：42

作者：

Furukawa, S ^{[1
]}

Mehregany, M ^{[1
]}

机构：

[1] CASE WESTERN RESERVE UNIV,DEPT ELECT ENGN & APPL PHYS,CLEVELAND,OH 44106

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 1996年 / 56卷 / 03期

关键词：

electroless plating; nickel; high aspect ratio; chemical roughening;

D O I：

10.1016/S0924-4247(96)01318-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

An electroless plating process for the fabrication of nickel micromechanical structures on a silicon substrate has been investigated. Appropriate chemical roughening of the silicon surface is found to be critical for good adhesion of the nickel to the silicon substrate. The optimum temperature and pH of the elecroless plating solution for smooth nickel films (e.g., R(a) of 23 Angstrom) with practical plating rates (e.g., 15 mu m h(-1)) are determined. Electroless plating is shown to be a suitable process for the fabrication of micromechanical structures.

引用

页码：261 / 266

页数：6

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