Influence of AlN intergranular phases on wetting and bonding between copper and aluminum nitride

被引：7

作者：

Joyeux, T ^{[1
]}

Jarrige, J ^{[1
]}

Labbe, JC ^{[1
]}

Lecompte, JP ^{[1
]}

机构：

[1] SPCTS, CNRS UMR 6638, F-87060 Limoges, France

来源：

EURO CERAMICS VII, PT 1-3 | 2002年 / 206-2卷

关键词：

yttrium aluminates; YAG; YAP; YAM; aluminum nitride; copper; joining; wettability; Direct Bonding Copper (DBC); thermal diffusivity;

D O I：

10.4028/www.scientific.net/KEM.206-213.555

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 [材料科学与工程]; 080502 [材料学];

摘要：

Direct Bonding Copper (DBC) process was considered for bonding copper on aluminum nitride. To study influence of AN intergranular phases, the three yttrium aluminates (YAG, YAP, YAM) were formed by solid-solid reaction between Al2O3 and Y2O3 with optimal purity and densification. Microstructural and thermal characterizations were performed. Wettability experiments were conducted with pure and oxidized copper to simulate contacts between aluminates phases and copper during bonding of copper to aluminum nitride. The behaviour of copper on aluminates was found near to that of copper on oxidized aluminum nitride substrates used for Cu/AlN assemblies.

引用

页码：555 / 558

页数：4

共 5 条

[1]

INVESTIGATION OF PHASE-STABILITY IN Y2O3-AL2O3 SYSTEM [J].