A cost analysis on the next generation lithography technology

被引:3
作者
Gomei, Y [1 ]
机构
[1] NTT Corp, Atsugi Res Ctr, Assoc Super Adv Elect Technol, Atsugi, Kanagawa 2430198, Japan
来源
EMERGING LITHOGRAPHIC TECHNOLOGIES III, PTS 1 AND 2 | 1999年 / 3676卷
关键词
cost estimate; next generation lithography; X-ray; IPL; EUV; SCALPEL;
D O I
10.1117/12.351075
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
A cost of ownership (CoO) model is used to analyze the cost of the next generation lithography(NGL) technology which includes proximity X-ray, ion beam projection(IPL), EUV and SCALPEL. The model takes into account the equipment cost, throughput, resist/process cost and mask cost. The purpose of this paper is to propose a baseline to discuss on the NGL CoO issue. General conclusion is that X-ray appears to be most cost-effective. This is the case when plural steppers are installed to a storage ring. IPL has to use a certain extent of complementary mask mode which may increase the IPL total cost. EUV appears to require higher throughput to be cost-competitive to other technologies because of expected higher machine and mask costs. SCALPEL may have difficulty to attain competent throughput. The key feature in this case is the electron beam current and the width of a unit exposure field covered by electron beam scanning.
引用
收藏
页码:1 / 8
页数:6
相关论文
共 8 条
  • [1] Extendibility of synchrotron radiation lithography to the sub-100 nm region
    Deguchi, K
    Miyoshi, K
    Oda, M
    Matsuda, T
    Ozawa, A
    Yoshihara, H
    [J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 1996, 14 (06): : 4294 - 4297
  • [2] GOMEI Y, 1998, SEMICONDUCTOR IN JUL, P143
  • [3] GWYN C, 1997, EXTREME ULTRAVIOLET
  • [4] HARRIOTT L, SCALPEL PROJECTION E
  • [5] Design of beamline optics for large-field exposure
    Hasegawa, M
    Gomei, Y
    Hisatsugu, T
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (12B): : 6845 - 6850
  • [6] *IPL PROJ GROUP, 1998, INT SEMATECH NOV
  • [7] LIDDLE JA, SCALPEL PROJECTION E
  • [8] 1997, UNPBU SEMATECH 0912