Ultrasonic joining of Si3N4 plates at 19 kHz using Al, Cu and Ni plates as insert metal

被引：9

作者：

Okamura, N ^{[1
]}

Watanabe, Y ^{[1
]}

机构：

[1] Takushoku Univ, Fac Engn, Dept Elect & Syst, Hachioji, Tokyo 1938585, Japan

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1999年 / 38卷 / 10期

关键词：

joining of ceramic plates; ultrasonic joining using vibration parallel to joining surface; joining by insert metal; joining of silicon nitride; ultrasonic welding;

D O I：

10.1143/JJAP.38.6166

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

Ultrasonic joining of ceramic plates using the lateral face of a rod vibrating longitudinally at 19 kHz was studied. We joined two 2-mm-thick silicon nitride (Si3N4) plates with an insert metal plate sandwiched between the Si3N4 plates. The insert metal has a high melting point so that the joint is resistant to high temperatures. The insert metals that we used were Al, Cu and Ni. The joining tool was a straight bar vibrating longitudinally at 19 kHz. The lateral face of the bar was vigorously rubbed against the ceramic plate and the resultant increase in temperature was high enough to enable joining of the plates. The joining, which was acomplished in 3-5 s, was performed without any surface pretreatment.

引用

页码：6166 / 6169

页数：4

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Watanabe, Y ;

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JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (5B) :3263-3266

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