Mechanical and thermo-mechanical failure mechanism analysis of fiber/filler reinforced phenolic matrix composites

被引:54
作者
Wang, SZ [1 ]
Adanur, S [1 ]
Jang, BZ [1 ]
机构
[1] AUBURN UNIV,COLL ENGN,AUBURN,AL 36849
关键词
phenolic composite; graphite; glass; ceramic; carbon black; failure mechanism; thermal stress; mechanical behavior;
D O I
10.1016/S1359-8368(96)00042-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Three groups of phenolic matrix composites were investigated in this study: (1) powder (glass, ceramic and carbon black) filled phenolic resin, (2) graphite fiber reinforced phenolic resin, and (3) graphite fiber/glass powder reinforced phenolic resin. In the first part of this study, the three-point bending test method was used to measure the mechanical properties of these composites. The graphite fiber/10 wt% glass powder tilled phenolic composite exhibited higher flexural strength and flexural modulus than the unfilled graphite fiber reinforced phenolic resin composite. Samples were examined using an optical microscope and scanning electron microscope (SEM). The amount of wedge-shaped voids could be greatly reduced by introducing the glass powder to the phenolic resin. The filler acted to delay crack propagation by deflecting the crack such that it propagated along the interface of the carbon fiber and the matrix. In the second part of this study, the effects of temperature (up to 500 degrees C) on the mechanical properties of graphite fiber reinforced phenolic (G/P) and graphite fiber/glass particle reinforced (G/g-P) composites were investigated. The results show that G/g-P composites exhibited higher flexural strength and flexural modulus than the G/P composites at exposure temperatures up to 360 degrees C. The thermal stresses induced due to heating in the composite were analyzed by the Thick-Cylinder Model (TCM) and Selsing's model. At temperatures above 300 degrees C, tensile thermal stresses tended to promote the formation of micro-cracks at the fiber/matrix interface, which degraded the properties of G/P composites. Debonding between the glass particle and the matrix occurred at a temperature above 360 degrees C, which greatly degraded the properties of G/g-P composites. (C) 1997 Elsevier Science Limited.
引用
收藏
页码:215 / 231
页数:17
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