Microsample tensile testing of LIGA nickel for MEMS applications

被引：95

作者：

Hemker, KJ ^{[1
]}

Last, H

机构：

[1] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA

[2] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA

[3] Inst Def Anal, Alexandria, VA USA

[4] USN, Ctr Surface Warfare, Indian Head Div, Alexandria, VA USA

来源：

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2001年 / 319卷

基金：

美国国家科学基金会;

关键词：

LIGA Ni components; microsample tensile testing; MEMS applications;

D O I：

10.1016/S0921-5093(01)00956-X

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Electro-deposited LIGA Ni components are being considered for use in a number of microelectromechanical systems (MEMS) and applications. The metrology of these components and their non-equilibrium microstructures play an important role in determining the mechanical response of these structures. Microsample testing has proven to be a reliable way of measuring the elastic and plastic tensile properties of these 100-200 mum thick films. Measured values of the in-plane Young's modulus (180 +/- 24 GPa) are significantly lower than the modulus for bulk coarse grained Ni (207 GPa), but can be explained and modeled in terms of the crystallographic texture in the as-deposited films. Variations in strength associated with post-processing heat treatments are highlighted and explained in terms of microstructural coarsening. The effect that coarsening and the related drop in strength have on the performance of LIGA Ni spring-like structures is discussed. and the need for further high temperature testing is highlighted. (C) 2001 Elsevier Science B.V. All rights reserved.

引用

页码：882 / 886

页数：5

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