I-DDQ testing: Issues present and future

被引：33

作者：

Soden, JM ^{[1
]}

Hawkins, CF ^{[1
]}

机构：

[1] UNIV NEW MEXICO, ALBUQUERQUE, NM 87131 USA

来源：

IEEE DESIGN & TEST OF COMPUTERS | 1996年 / 13卷 / 04期

关键词：

D O I：

10.1109/54.544537

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

I-DDQ testing has progressed to become a mainstream test method, but two issues confront this highly efficient test practice. One issue is the cost impact of product loss due to increased defect detection. The other is the increased background current associated with the new deep-submicron technologies.

引用

页码：61 / 65

页数：5

共 21 条

[1]

ATHAN SP, 1996, P IDDQ TEST WORKSH

[2]

DAVIDSON S, 1994, INTERNATIONAL TEST CONFERENCE 1994, PROCEEDINGS, P572, DOI 10.1109/TEST.1994.528001

[3]

Gattiker A. E., 1996, Proceedings. 14th IEEE VLSI Test Symposium (Cat. No.96TB100043), P112, DOI 10.1109/VTEST.1996.510844

[4]

HAWKINS CF, 1994, INTERNATIONAL TEST CONFERENCE 1994, PROCEEDINGS, P413, DOI 10.1109/TEST.1994.527983

[5]

HAWKINS CF, 1986, P IEEE INT TEST C, P443

[6]

HAWKINS CF, 1996, IEEE SPECTRUM JAN, P68

[7]

HENRY TR, 1996, IN PRESS P INT TEST

[8]

HU C, IEEE T ELECTRON DEV, V32, P375

[9]

MALY W, 1988, P INT C COMP AID DES, P344

[10]

MALY W, 1992, J ELECTRON TEST, P111

← 1 2 3 →