Effect of Microstructural Development on Mechanical and Electrical Properties of Inkjet-Printed Ag Films

被引：36

作者：

Kim, Inyoung ^{[1
]}

Song, Young Ah ^{[1
]}

Jung, Hyun Chul ^{[1
]}

Joung, Jea Woo ^{[1
]}

Ryu, Sung-Soo ^{[2
]}

Kim, Jongryoul ^{[3
]}

机构：

[1] Samsung Electromech Co Ltd, Cent R&D Inst, Suwon 443743, Gyunggi Do, South Korea

[2] Korea Inst Ceram Engn & Technol, Inchon 467843, Gyunggi Do, South Korea

[3] Hanyang Univ, Dept Mat Sci & Engn, Ansan 426791, Gyunggi Do, South Korea

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 12期

关键词：

Inkjet printing technology; mechanical properties; powder processing; sintering; microstructure;

D O I：

10.1007/s11664-008-0552-y

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The microstructural characterization of inkjet-printed Ag films sintered at various conditions was carried out to analyze the effect of microstructure on mechanical and electrical properties. As expected, the films became denser with grain growth with increasing sintering time and temperature, which resulted in improvement in mechanical properties. However, the resistivity of the films reached a minimum value of 3.0 mu ohm cm before full densification. In order to improve the mechanical properties, pressure-assisted sintering was introduced. As a result, inkjet-printed Ag films sintered at 250 degrees C under 5 MPa showed a tensile strength of 550 MPa, elongation of 2.4%, Young's modulus of 55 GPa, and resistivity of similar to 3.0 mu ohm cm.

引用

页码：1863 / 1868

页数：6

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