Chip scale packaging

Chip-scale packages are designed to provide convenient protection for integrated circuits. The use of small packages reduces overall system size which is desirable for portable electronic products. The types of chip-scale packages include rigid interposers, flexible interposers, custom lead-frame, and wafer-scale types. Packages with flip-chip attach use an under-encapsulation between the die and the substrate. The size and construction suit chip-scale packages better than their conventional counterparts to providing improved electrical performance. Changing from the wire-bond to the flip-chip attach method decreases connector length, increases connector cross sectional area, and so decreases power and ground inductance.