An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures

被引:53
作者
Haque, S [1 ]
Xing, K [1 ]
Lin, RL [1 ]
Suchicital, CTA [1 ]
Lu, GQ [1 ]
Nelson, DJ [1 ]
Borojevic, D [1 ]
Lee, FC [1 ]
机构
[1] Virginia Tech, Ctr Power Elect Syst, Blacksburg, VA 24061 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 1999年 / 22卷 / 02期
关键词
terms-integrated packaging; parasitic inductance calculation; power electronics building blocks; power electronics packaging; solderable device contacts; wire-bonds;
D O I
10.1109/6040.763184
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Power electronics building blocks (PEBB's) are envisioned as integrated power modules consisting of power semiconductor devices, power integrated circuits, sensors, and protection circuits for a wide range of power electronics applications, such as inverters for motor drives and converters for power processing equipment, At the Center for Power Electronics Systems, we developed a topology for a basic building block-a two-switch two-diode half-bridge converter in totem-pole configuration with built-in gate-driver and protection circuitry, fiberoptic receiver/transmitter interface, and soft-switching capability. Based on the topology, a series of prototype modules, with 600 V, 3.3 kW rating, were fabricated using an innovative packaging technique developed for the program-metal posts interconnected parallel plate structure (MPIPPS). This new packaging technique uses direct attachment of bulk copper, not wire-bonding of fine aluminum wires, fur interconnecting power devices. Electrical performance data of the packaged devices show that an air-cooled 15 kW inverter, operating from 400 V de bus with 20 kHz switching frequency can be constructed by integrating three prototype modules, which is almost double of what could not be achieved with commercially packaged devices of the same rating.
引用
收藏
页码:136 / 144
页数:9
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